CONSIDERATIONS REGARDING THE USE OF SU-8 PHOTORESIST IN MEMS TECHNIQUE

  • Maria Roxana Marinescu National Institute for Research and Development in Microtechnologies, IMT-Bucharest
  • Marioara Avram 2National Institute for Research and Development in Microtechnologies, IMT-Bucharest
  • Catalin Parvulescu 3National Institute for Research and Development in Microtechnologies, IMT-Bucharest
  • Corneliu Voitincu 4National Institute for Research and Development in Microtechnologies, IMT-Bucharest
  • Vasilica Tucureanu 5National Institute for Research and Development in Microtechnologies, IMT-Bucharest
  • Alina Matei 6National Institute for Research and Development in Microtechnologies, IMT-Bucharest
Keywords: Photolithography, photoresist, SU-8, micro-electro-mechanical systems (MEMS), microfluidics

Abstract

Microelectromechanical systems (MEMS) represent the technology of microscopic devices. In this domain, photolithography is the most common method in order to obtain MEMS structures. The photoresist is the key element for microelectronic and MEMS technology. SU-8 is one kind of negative photoresist, used basically for microfluidics. This paper presents experiments of SU-8 etching in O2/SF6 and Ar/SF6 plasma. Monocrystalline silicon wafers with 3" diameter were used, which had native oxide preserved. The SU-8 was spin-coated on the wafers with a thickness of approximately 100 μm. The experiments were made with varying the gas flow rate and the pressure in the reactor. The etching depth and the underetching gave different values every time.

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Published
2018-09-28
How to Cite
Marinescu, M., Avram, M., Parvulescu, C., Voitincu, C., Tucureanu, V., & Matei, A. (2018). CONSIDERATIONS REGARDING THE USE OF SU-8 PHOTORESIST IN MEMS TECHNIQUE. Nonconventional Technologies Review, 22(3). Retrieved from http://revtn.ro/index.php/revtn/article/view/34